Laser drilling creates precise, consistent holes through a material. This non-contact process offers control of hole diameter, taper, depth, and placement with exceptional repeatability since there is no tool wear. Laser processing can also offer smaller feature sizes than traditional manufacturing methods, allowing it to become the manufacturing method of choice as devices become increasingly smaller and more complex.

Drilling Can Include:

• Injection nozzles

• PCBs and electronic wafers (VHD link)

• Jewel bearings

• Ceramics

• Venting and cooling

• Semiconductor probe cards (link)

• Textile spinning nozzles